The unique No Clean flux vehicle of Microprint P2006 offers excellent soldering of both leaded and lead free alloys, 2006 is designed for use with a variety of substrate materials including Sn/Pb, Au/Ni and OSP treated finishes. The solder paste is available with formulations to offer print speeds ranging from 20 to 300mm per second, with a Pin Testable formulation available, allowing easy penetration of test probes through the post soldering residues. Microprint P2006 is suitable for use with air and nitrogen reflow systems.
Alloy: TSC 88.0%
Storage Temperature : -20°C and +5°C.
Microprint Solder Paste Lead Free 40G
- Product Code: 170-180
- Availability: 7
- Packaging: Syringe
- Pack Quantity: 40G
- Country of Origin: United Kingdom
- Life Cycle: Current
- RoHS: Yes
- Tarrif No: 38101000
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Price (each) excluding VAT