Future HF Rework Gel is a halide free, no clean rework product designed to provide sufficient tack, heat stability and activation for all component conditions. Future HF Rework Gel is an approved no clean product in accordance with Bellcore GR78 Core and J-STD-004 (Type ROL0). It can be used with dedicated rework stations or independently with the use of soldering irons, and is suitable for SMT and conventional through hole devices.

Future HF Rework Gel can be used by applying once for both component removal and addition, leaving a minimal amount of transparent residue after use. Benefits • Halide Free • J-STD-004: Type ROL0 • Minimal Clear Residue • Can be used with or without a needle/tip Propert